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Loctite® 5420 Heat Cure Form-In-Place Electrically Conductive Silicone Sealant

 

Subcategory: Silicone; Adhesive; Thermoset

Material Notes:

Electrically Conductive Bonders and Gasketing and Wire Tackers
Loctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditional methods such as solder, are not practical. Electrically Conductive Adhesives are ideal for attaching temperature sensitive components, or providing electrical interconnections on non-solderable substrates, such as plastic and glass.

Loctite offers a complete line of electrically conductive adhesives to meet almost any need including: flexible, heat cure, room temperature cure, screen printable, high adhesion, and rapid cure.

Loctite® innovative gasketing products offer precise, reliable sealing of electronic enclosures, protecting them from environmental hazards. Loctite offers both Form-in-place (FIP) and Cure-in-Place (CIP) compression gasket materials.

Loctite® Tak Pak Adhesives are used to secure wires to printed circuit board assemblies. The fast cure times of these adhesives help increase the throughput of the wire tacking assembly process.

Loctite® 5420 Heat Cure Form-In-Place Electrically Conductive Silicone Sealant
Provides a resilient ground path for sensitive electronic devices. A non-corrosive form-in-place electrically conductive silicone that provides a ground path for sensitive electronic devices. Black paste heat cures in minutes to form a resilient seal. Volume resistivity is 150 O-cm. Cure Type: Heat Bonding Type: Silicone

Available Properties
  • Density
  • Hardness, Shore A
  • Tensile Strength, Ultimate
  • Elongation at Break
  • Volume Resistivity
  • Cure Time
  • Shelf Life
  • Color
  • Extrusion Rate
  
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