Loctite® 3861 Thermally Conductive Potting

Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:

Thermally Conductive Bonders and Potters
Loctite® Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips, while providing the most efficient thermal transfer between transistors or microprocessors and their heat sinks. Loctite offers a wide range of adhesive chemistries including silicones, acrylics and epoxies. Many processing options are available for curing these adhesives such as heat cure, activator cure, and UV light.

Loctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.

Loctite provides a variety of potting chemistries and processing options which are unmatched in the microelectronics industry. For electronics assembly, Loctite offers deep potting, high adhesion, non-corrosive, and thermally conductive potting products. These can be cured with heat, UV light, or moisture.

Loctite® 3861 Thermally Conductive Potting
A thermally conductive, potting compound for automotive electronic applications requiring thermal conductivity and chemical resistance. Resistant to water, gases and petroleum vapors. Cure Type: Heat Bonding Type: 2-part epoxy (100:9.5)