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Master Bond Polymer System FL901S


Subcategory: Epoxy; Thermoset; Polymer; Adhesives, Sealants, and Coatings

Material Notes:
One Component Silver Filled Electrically Conductive Adhesive Film Featuring Convenient Handling, Good Storage Stability & Fast Cure

Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration is recommended to maximize the shelf life. This specially developed one component formulation features outstanding electrical conductivity, superior mechanical strength plus excellent adhesive properties to both similar and dissimilar substrates. An additional attractive characteristic of this silver conductive film is its ability to cure quickly at moderate temperatures e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). The standard thickness is 3 mils, although other thicknesses are available. The film processes very easily and squeeze out during bonding is minimal. Master Bond FL901S has excellent electrical conductivity over an exceptionally wide temperature range from -100°F to 400°F. Even at elevated temperatures of 300°C the weight loss is less than 0.70%. At room temperature Master Bond FL901S features a low volume resistivity of less than 2 milliohms as well as an excellent thermally conductivity of greater than 10 BTU•in/ft²•hr•°F. It can be used for bonding electronic components onto substrates as well as for applications where EMI/RFI shielding is needed. Master Bond FL901S film adhesive offers the convenience of easy to apply non-mix system along with the high performance profile required in specialty electronic applications. Master Bond FL901S is also available in preformed shapes upon request. Additionally, Master Bond can apply the film directly onto parts supplied and return them to the end user for assembly.

Information provided by Master Bond Inc.

Available Properties
  • Thickness
  • Thermal Conductivity
  • Cure Time
  • Weight Loss, %
Property Data

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