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Master Bond Hot Melt MB514


Subcategory: Epoxy; Thermoset; Polymer

Material Notes:
High performance melt adhesive; Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105

Master Bond Hot Melt MB514 is a high performance hot melt adhesive with the following key features: It is particularly suited for use on untreated surfaces of high and low density polyethylene, polypropylene, ultra-high molecular weight polyethylene and combinations of these substrates. MB514 bonds untreated polyolefins for structural applications. It provides excellent bond performance over the temperature range of -20°F to 190°F (-29°C to 88°C). MB514 is 100% solids and contains no solvents. Bond strengths develop rapidly with no need for clamps or post cure during assembly.

Information provided by Master Bond Inc.

Available Properties
  • Solids Content
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
Property Data

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