MatWeb - Material Property Data 用 MatWeb 登广告!    Register Now
越过59,000 以上, 金属、塑料、陶瓷和合成物的数据资料库。
MatWeb - Material Property Data 主页  •  搜寻  •  工具  •  供应商  •  文件夹  •  有关我们  •  常用问题  •  登录   •  English English English 
  搜寻方法:  高级先进 | 材料类型 | 特性 | 构成份  | 商标  | 制造商

Subscribe to FREE Trade Publications!

Cookson Group Plaskon® SMT-B1 Molding Compound for PBGAs


Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
This material is an epoxy molding compound designed specifically for grid arrays (BGA/LGA). It is formulated with a unique resin system, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid arrays.


  • Improved wire sweep performance
  • Low stress
  • Minimal warpage
  • Outstanding high temperature flexural strength

Information provided by Cookson Electronics

Available Properties
  • Specific Gravity
  • Viscosity
  • Linear Mold Shrinkage
  • Spiral Flow
  • Ash
  • Storage Temperature
  • Hardness, Shore D
  • Flexural Modulus
  • Flexural Strength
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • CTE, linear 20°C
  • Thermal Conductivity
  • Glass Temperature
  • Flammability, UL94
  • Oxygen Index
  • Mold Temperature
  • Back Pressure
  • Cure Time
  • Cure Time
  • Gel Time
  • Shelf Life
  • Hydrolyzable Halides
Property Data

This page displays only the text
of a material data sheet.

To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
), please click the button below.

<meta http-equiv=Content-Type content="text/html; charset=UTF-8">
请读关于材料数据的使用许可协议和我们的隐私权。询问或评论有关 MatWeb? 请与 联系。我们感谢您对 MatWeb的参与。

本站点由 Automation Creations, Inc. 设计和维护。这个网站的内容, MatWeb 的商标,与 "MatWeb" 由 Automation Creations, Inc.版权1996-2006拥有 。 MatWeb 意欲为个人使用 , 非商业用途。这个站点的内容、结果和技术数据,未经由 Automation Creations, Inc. 允许, 不可以被电子,摄影或实质上地再生产或自动化创作。