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Cookson Group Plaskon® SMT-B-1RC Molding Compound for PBGAs

 

Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
This material is an epoxy molding compound optimized specifically for PBGA applications. It is a fast cure molding compound for automold applications. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA applications.

Features:

  • Faster cure speed
  • Improved wire sweep performance
  • Improved warp performance
  • High productivity
  • Lower viscosity
  • Reduced cure time

Information provided by Cookson Electronics

Available Properties
  • Specific Gravity
  • Viscosity
  • Linear Mold Shrinkage
  • Spiral Flow
  • Ash
  • Storage Temperature
  • Hardness, Shore D
  • Flexural Modulus
  • Flexural Strength
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • CTE, linear 20°C
  • Thermal Conductivity
  • Glass Temperature
  • Flammability, UL94
  • Oxygen Index
  • Mold Temperature
  • Back Pressure
  • Cycle Time - Injection
  • Cure Time
  • Gel Time
  • Shelf Life
  • Hydrolyzable Halides
  • Preheat Temperature
   
Property Data

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