Cookson Group Plaskon® SMT-B-1LAS Low Alpha Molding Compound for PBGAs
Subcategory: Epoxy; Adhesive; Thermoset
Material Notes: This material is an epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. An all-spherical filler system ensures outstanding moldability both with automated and conventional molding systems. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid array applications. Features: - Minimal warpage
- Low stress
- Low viscosity
- Low alpha particle content
- Outstanding high temperature flexural strength
Information provided by Cookson Electronics
Available Properties |
- Specific Gravity
- Viscosity
- Linear Mold Shrinkage
- Spiral Flow
- Ash
- Storage Temperature
- Hardness, Shore D
- Flexural Modulus
- Flexural Strength
- Volume Resistivity
- Dielectric Constant
- Dielectric Strength
- Dissipation Factor
- CTE, linear 20°C
- Thermal Conductivity
- Glass Temperature
- Flammability, UL94
- Oxygen Index
- Mold Temperature
- Back Pressure
- Cure Time
- Cure Time
- Gel Time
- Shelf Life
- Alpha Particle Count
- Hydrolyzable Cl
- Preheat Temperature
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Property Data |
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