Cookson Group Plaskon® SMT-B-1LAR Low Alpha, Fast Curing Molding Compound for PBGAs

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Cookson Group Plaskon® SMT-B-1LAR Low Alpha, Fast Curing Molding Compound for PBGAs

Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
This material is an epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. An all spherical filler system ensures outstanding moldability especially with automated and conventional molding systems. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid array applications.

Features:

Minimal warpage
Low stress
Low viscosity
Low alpha particle content
Outstanding high temperature flexural strength

Information provided by Cookson Electronics

Available Properties

Specific Gravity
Viscosity
Linear Mold Shrinkage
Spiral Flow
Ash
Storage Temperature
Hardness, Shore D
Flexural Modulus
Flexural Strength
Volume Resistivity
Dielectric Constant
Dielectric Strength
Dissipation Factor
CTE, linear 20°C
Thermal Conductivity
Glass Temperature
Flammability, UL94
Oxygen Index
Mold Temperature
Back Pressure
Cure Time
Cure Time
Gel Time
Shelf Life
Alpha Particle Count
Hydrolyzable Cl
Preheat Temperature

Property Data

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