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Cookson Group Plaskon® MUF-2A LAR Molded Underfill Compound for Flip Chip BGAs and CSPs

 

Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
This material is a epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF is the total molded underfill solution for Flip Chip in Package.

Features:

  • Higher productivity
  • Higher glass transition temperature
  • Higher reliability
  • Lower warpage
  • Lower CTE
  • Lower cost of ownership
  • Minimum 220°C reflow
  • Minimum JEDEC level 3

Applications:

Plaskon? MUF-2A LAR Molded Underfill is suitable for high volume underfill and overmold protection of Flip Chip BGA and CSP packages. It is suitable for stack die packages using a combination of wirebonded and flip chip dies where the combination of low wire sweep and underfill properties are essential.

Information provided by Cookson Electronics

Available Properties
  • Specific Gravity
  • Viscosity
  • Linear Mold Shrinkage
  • Spiral Flow
  • Ash
  • Storage Temperature
  • Hardness, Shore D
  • Flexural Modulus
  • Flexural Strength
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • CTE, linear 20°C
  • Thermal Conductivity
  • Glass Temperature
  • Flammability, UL94
  • Mold Temperature
  • Back Pressure
  • Cure Time
  • Gel Time
  • Shelf Life
  • Alpha Particle Count
  • Hydrolyzable Halides
  • Preform Temperature
  • Transfer Time
   
Property Data

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