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Cookson Group Plaskon® SMT-B-2 Molding Compound for PBGA and CSP


Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
This material is an epoxy molding compound for high temperature, lead-free reflow. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 260°C IR reflow temperatures.


  • Lower moisture pickup
  • Excellent moldability
  • Low wire sweep
  • Fast cure

Information provided by Cookson Electronics

Available Properties
  • Specific Gravity
  • Moisture Absorption at Equilibrium
  • Viscosity
  • Spiral Flow
  • Ash
  • Storage Temperature
  • Hardness, Shore D
  • Flexural Modulus
  • Flexural Strength
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • CTE, linear 20°C
  • Thermal Conductivity
  • Glass Temperature
  • Flammability, UL94
  • Mold Temperature
  • Back Pressure
  • Cure Time
  • Cure Time
  • Gel Time
  • Shelf Life
  • Hydrolyzable Halides
Property Data

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