Cookson Group Plaskon® NXG-1HS Next Generation Molding Compound for Heat Spreader Applications
Subcategory: Epoxy; Adhesive; Thermoset
Material Notes: This material is an epoxy molding compound for high temperature, lead-free reflow in heat spreader applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, hybrid resin developed to pass JEDEC Level 2A at 260°C IR reflow temperature. It is a “green” compound with no halogens and a lower Tg than multifunctional materials. Features: - Very low moisture pickup
- No halogens "green"
- Good moldability
- Fast cure
Information provided by Cookson Electronics
Available Properties |
- Specific Gravity
- Moisture Absorption at Equilibrium
- Viscosity
- Spiral Flow
- Ash
- Storage Temperature
- Hardness, Shore D
- Flexural Modulus
- Flexural Strength
- CTE, linear 20°C
- Thermal Conductivity
- Glass Temperature
- Flammability, UL94
- Mold Temperature
- Back Pressure
- Cure Time
- Cure Time
- Gel Time
- Shelf Life
- Hydrolyzable Halides
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Property Data |
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