MatWeb - Material Property Data 用 MatWeb 登广告!    Register Now
越过59,000 以上, 金属、塑料、陶瓷和合成物的数据资料库。
MatWeb - Material Property Data 主页  •  搜寻  •  工具  •  供应商  •  文件夹  •  有关我们  •  常用问题  •  登录   •  English English English 
  搜寻方法:  高级先进 | 材料类型 | 特性 | 构成份  | 商标  | 制造商

Subscribe to FREE Trade Publications!

Cookson Group Plaskon® 3400F-14 Conventional Encapsulant


Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
This material is a fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. It was developed with fine filler particles especially for use with automated or conventional molding equipment and offers a balance of end use properties.


  • Excellent moldability
  • Superior cosmetics
  • Improved markability
  • Fast cycle times

Information provided by Cookson Electronics

Available Properties
  • Specific Gravity
  • Viscosity
  • Spiral Flow
  • Ash
  • Storage Temperature
  • Hardness, Shore D
  • Flexural Modulus
  • Flexural Strength
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • Arc Resistance
  • CTE, linear 20°C
  • Thermal Conductivity
  • Glass Temperature
  • Flammability, UL94
  • Oxygen Index
  • Mold Temperature
  • Back Pressure
  • Cure Time
  • Cure Time
  • Gel Time
  • Shelf Life
  • Hydrolyzable Cl
Property Data

This page displays only the text
of a material data sheet.

To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
), please click the button below.

<meta http-equiv=Content-Type content="text/html; charset=UTF-8">
请读关于材料数据的使用许可协议和我们的隐私权。询问或评论有关 MatWeb? 请与 联系。我们感谢您对 MatWeb的参与。

本站点由 Automation Creations, Inc. 设计和维护。这个网站的内容, MatWeb 的商标,与 "MatWeb" 由 Automation Creations, Inc.版权1996-2006拥有 。 MatWeb 意欲为个人使用 , 非商业用途。这个站点的内容、结果和技术数据,未经由 Automation Creations, Inc. 允许, 不可以被电子,摄影或实质上地再生产或自动化创作。