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Cookson Group Plaskon® 3400F-14 Conventional Encapsulant

 

Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
This material is a fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. It was developed with fine filler particles especially for use with automated or conventional molding equipment and offers a balance of end use properties.

Features

  • Excellent moldability
  • Superior cosmetics
  • Improved markability
  • Fast cycle times

Information provided by Cookson Electronics

Available Properties
  • Specific Gravity
  • Viscosity
  • Spiral Flow
  • Ash
  • Storage Temperature
  • Hardness, Shore D
  • Flexural Modulus
  • Flexural Strength
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • Arc Resistance
  • CTE, linear 20°C
  • Thermal Conductivity
  • Glass Temperature
  • Flammability, UL94
  • Oxygen Index
  • Mold Temperature
  • Back Pressure
  • Cure Time
  • Cure Time
  • Gel Time
  • Shelf Life
  • Hydrolyzable Cl
  
Property Data

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