Cookson Group Plaskon® MUF-LFG Molded Underfill Compound for Flip Chip BGAs and CSPs, Lead-Free Green

Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF is the total molded underfill solution for Flip Chip in Package.

Features:

• Higher productivity
• Higher Tg
• Higher reliability
• Lower warpage
• Lower CTE
• Lower cost of ownership
• Minimum 220°C reflow
• Minimum JEDEC Level 3

Applications:

Plaskon MUF-LFG Molded Underfill is suitable for high volume underfill and overmold protection of Flip Chip BGA and CSP packages. It is suitable for stack die packages using a combination of wirebonded and flip chip dies where the c