Cookson Group STAYSTIK® 571 Silver Filled Electrically Conductive Film

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Cookson Group STAYSTIK® 571 Silver Filled Electrically Conductive Film

Subcategory: Adhesive; Thermoset; Polymer

Material Notes:
These thermoplastic adhesive films are designed for use in a variety of electronic applications. These materials are characterized by their excellent bonding at low process temperatures and extremely low ELASTIC MODULUS (60,000psi). The compliancy of these adhesives allows for the bonding of two materials having large dissimilarities in thermal expansion coefficients (TCEs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features:

Fully polymerized resin - No "cure"
Easily reworkable - No outgassing
Bonds in seconds - Not hours or minutes
Low modulus reduces stress to bonded materials

Information provided by Cookson Electronics

Available Properties

Modulus of Elasticity
Adhesive Bond Strength
Volume Resistivity
Thermal Conductivity
Maximum Service Temperature, Air
Minimum Service Temperature, Air
Glass Temperature
Shelf Life
Attatch Temperature
Excursion Temperature
Filler Material

Property Data

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