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Cookson Group STAYSTIK® 682 Aluminum Nitride Filled Thermally Enhanced Film


Subcategory: Adhesive; Thermoset; Polymer

Material Notes:
These thermoplastic adhesive films are designed for use in a variety of electronic applications. These materials are characterized by their excellent bonding. These films can be used for die attach and/or substrate attach in hybrid or Multi-Chip Modules (MCMs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.


  • Fully polymerized resin - No "cure"
  • Easily reworkable - No outgassing
  • Bonds in seconds - Not hours or minutes
  • Low modulus reduces stress to bonded materials

Information provided by Cookson Electronics

Available Properties
  • Modulus of Elasticity
  • Adhesive Bond Strength
  • Volume Resistivity
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Glass Temperature
  • Shelf Life
  • Attatch Temperature
  • Excursion Temperature
  • Filler Material
Property Data

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