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Cookson Group STAYSTIK® 301G Non-Filed Dielectric Interposer Paste


Subcategory: Adhesive; Thermoset

Material Notes:
These thermoplastic adhesive pastes are designed for use in a variety of electronic applications. These materials are ideal for applications where resistance to high temperature excursions is desired. These paste adhesives can be used for die attaching solder sealed, hermetic packages and have demonstrated low RGA moisture readings. This high temperature, reworkable thermoplastic system offers many unique advantages in applications traditionally ill-suited to thermoset adhesives.


  • Fully polymerized resin - No "cure"
  • Easily reworkable - No outgassing
  • Bonds in seconds - Not hours or minutes
  • Low modulus reduces stress to bonded materials

Information provided by Cookson Electronics

Available Properties
  • Modulus of Elasticity
  • Adhesive Bond Strength
  • Volume Resistivity
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Glass Temperature
  • Shelf Life
  • Attatch Temperature
  • Excursion Temperature
  • Filler Material
Property Data

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