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Cookson Group STAYSTIK® Resin E Patented Technology Paste


Subcategory: Adhesive; Thermoset

Material Notes:
This thermoplastic adhesive paste is a solvent based polymer specially developed for temporary bonding applications most typically associated with tape head slider manufacturing but can be used for a variety of applications were temporary adhesion is necessary. This adhesive is commonly debonded in NMP leaving no residue or contamination on the surface of the debonded assembly.


  • Wafer lapping
  • Substrate cutting
  • Wafer cutting
  • Wafer polishing
  • Row bonding for dicing
  • Lens polishing

Information provided by Cookson Electronics

Available Properties
  • Adhesive Bond Strength
  • Drying Temperature
  • Attatch Temperature
  • Dwell Time
  • Pressure During Dwell Time
Property Data

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