Cookson Group STAYSTIK® 383G Non-Filed Dielectric Interposer Paste
Subcategory: Adhesive; Thermoset
Material Notes: These thermoplastic adhesive pastes are designed for use in a variety of electronic applications. These materials are characterized by their excellent bonding. These pastes can be used for die, lid seal and/or substrate attach in hybrid, Multi-Chip Modules (MCMs) or other microelectronic packages. The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives. Features: - Fully polymerized resin
- No chemical reaction
- Easily reworkable
- No outgassing
- Bonds in seconds
- Meets Mil-Std requirements
- Low modulus material
Information provided by Cookson Electronics
Available Properties |
- Modulus of Elasticity
- Adhesive Bond Strength
- Volume Resistivity
- Thermal Conductivity
- Maximum Service Temperature, Air
- Minimum Service Temperature, Air
- Glass Temperature
- Shelf Life
- Attatch Temperature
- Excursion Temperature
- Filler Material
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Property Data |
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