Cookson Group STAYCHIP® 3080 High Reliability Flip Chip Underfill, Fast Flow and Cure
Subcategory: Epoxy; Adhesive; Thermoset
Material Notes:
STAYCHIP 3080 is a high reliability capillary underfill designed for high performance adhesion to common mask, solder, and die passivation surfaces, even after exposure to elevated heat, pressure, and humidity. This material provides superior adhesion even after pressure cooker environmental conditioning. This fast flow underfill was formulated for penetration of gaps below 1mil. When fully cured, the material displays excellent reliability in thermal cycling performance. It is easily dispensed and also exhibits low moisture absorption for improved JEDEC performance. Features: - Excellent reliability in thermal cycling
- Excellent Reliability in JEDEC testing (L3 260°C on select laminate based FCIP)
- Low Moisture Absorption
- Exceptional Adhesion (even after exposure to high humidity, pressure, and temperature)
- Fast, Efficient Flow Properties
Information provided by Cookson Electronics
| Available Properties |
- Specific Gravity
- Filler Content
- Moisture Absorption at Equilibrium
- Viscosity
- Storage Temperature
- Hardness, Shore D
- Flexural Modulus
- Fracture Toughness
- Adhesive Bond Strength
- Dielectric Constant
- Dissipation Factor
- CTE, linear 20°C
- Glass Temperature
- Flash Point
- Pot Life
- Shelf Life
- Appearance
- Capillary Flow Time
- Chemical Type
- Etractable Ionic Contant, Chloride (Cl)
- Etractable Ionic Contant, Potassium (K)
- Etractable Ionic Contant, Sodium (Na)
- Particle Size
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| Property Data |
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