Cookson Group STAYCHIP® 3082 High Reliability Flip Chip Underfill, Low CTE
Subcategory: Adhesive; Thermoset
Material Notes:
STAYCHIP™ 3082 is a highly filled, high reliability capillary underfill designed for high performance applications. This material provides superior adhesion to common solder-mask and die passivations, even after exposure to elevated heat, pressure, and humidity for superior JEDEC performance. This fast flow underfill was formulated for penetration of gaps below 1 mil. When fully cured, the material displays excellent reliability in thermal cycling performance. It is easily dispensed and exhibits low moisture absorption for improved JEDEC performance. Features: - Excellent reliability in thermal cycling
- Excellent Reliability in JEDEC testing
- Low CTE
- High Tg
- Exceptional adhesion (even after exposure to high humidity, pressure, and temperature)
- Fast, efficient flow properties
- Small particle size filler for use on fine pitch array packages
- High filler loading while maintaining fast flow properties
Information provided by Cookson Electronics
| Available Properties |
- Specific Gravity
- Filler Content
- Moisture Absorption at Equilibrium
- Viscosity
- Storage Temperature
- Hardness, Shore D
- Adhesive Bond Strength
- Dielectric Constant
- Dissipation Factor
- CTE, linear 20°C
- Glass Temperature
- Flash Point
- Pot Life
- Shelf Life
- Appearance
- Chemical Type
- Etractable Ionic Contant, Chloride (Cl)
- Etractable Ionic Contant, Potassium (K)
- Etractable Ionic Contant, Sodium (Na)
- Particle Size
- Storage Modulus
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| Property Data |
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