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Cookson Group STAYCHIP® 3090.mk.01 High Productivity Capillary Underfill

 

Subcategory: Adhesive; Thermoset

Material Notes:
STAYCHIP 3090 is a highly filled, high reliability capillary underfill designed for high productivity flip applications. This material merges excellent stability with fast cure speed, fast flow times, and exceptional reliability performance. The reactivity of Staychip 3090 allows shipment of material in bulk quantities up to 20 ounce cartridges and storage in a conventional refrigerator at 5°C.

Features:

  • 5°C storage
  • Long pot life
  • Non-anhydride formulation
  • Capable to package in large containers to minimize syringe change out
  • Excellent adhesion (even after exposure to high humidity, pressure and temperature)
  • Fast, efficient flow properties
  • High filler loading while maintaining fast flow properties
  • Exceptional reliability in JEDEC testing
  • Proprietary filler technology

Information provided by Cookson Electronics

Available Properties
  • Specific Gravity
  • Filler Content
  • Moisture Absorption at Equilibrium
  • Viscosity
  • Storage Temperature
  • Hardness, Shore D
  • Fracture Toughness
  • CTE, linear 20°C
  • Glass Temperature
  • Flash Point
  • Pot Life
  • Shelf Life
  • Appearance
  • Capillary Flow Time
  • Chemical Type
  • Particle Size
  • Storage Modulus
   
Property Data

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