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Cookson Group STAYCHIP® 3105 Low Stress Underfill for Large Die Flip Chip


Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
STAYCHIP™ 3105 is an aromatic amine-cured epoxy underfill, designed for low stress and exceptional adhesion to common solder-mask and die passivation surfaces, even after exposure to elevated heat, pressure, and humidity. This material provides superior adhesion even after accelerated environmental conditioning. This fast flow underfill was formulated for penetration of gaps below 1 mil. When fully cured, the material displays excellent reliability in thermal cycle performance. It is easily dispensed and also exhibits low moisture absorption for improved JEDEC performance. Flip chip devices assembled with StaychipTM 3105 exhibit extremely low warpage and high radii of curvature to minimize induced stresses on fragile die architectures.


  • Minimal induced die stress
  • Low Package Warpage
  • Excellent Reliability in Thermal Cycling
  • Low Moisture Absorption
  • Exceptional Adhesion (even after exposure to high humidity, pressure, and temperature)
  • Fast, Efficient Flow Properties
  • Passes JEDEC Level 3/260°C flip chips up to 15mmx15mm size

Information provided by Cookson Electronics

Available Properties
  • Specific Gravity
  • Filler Content
  • Moisture Absorption at Equilibrium
  • Viscosity
  • Storage Temperature
  • Hardness, Shore D
  • Fracture Toughness
  • Adhesive Bond Strength
  • CTE, linear 20°C
  • Glass Temperature
  • Flash Point
  • Pot Life
  • Shelf Life
  • Appearance
  • Chemical Type
  • Etractable Ionic Contant, Chloride (Cl)
  • Etractable Ionic Contant, Potassium (K)
  • Etractable Ionic Contant, Sodium (Na)
  • Particle Size
  • Storage Modulus
Property Data

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