Cookson Group STAYCHIP® 3100 High Reliability Flip Chip Underfill
Subcategory: Epoxy; Adhesive; Thermoset
Material Notes:
STAYCHIP™ 3100 is an aromatic amine-cured epoxy underfill, designed for exceptional adhesion to common solder-mask and die passivation surfaces, even after exposure to elevated heat, pressure, and humidity. This material provides superior adhesion even after accelerated environmental conditioning. This fast flow underfill was formulated for penetration of gaps below 1mil. When fully cured, the material displays excellent reliability in thermal cycling performance. It is easily dispensed and also exhibits low moisture absorption for improved JEDEC performance. Features: - Excellent Reliability in Thermal Cycling
- Excellent Reliability in JEDEC testing (Level 3/ 260°C on select laminate-based FCIP)
- Low Moisture Absorption
- Exceptional Adhesion (even after exposure to high humidity, pressure, and temperature)
- Fast, Efficient Flow Properties
- Self-filleting Capability
Information provided by Cookson Electronics
| Available Properties |
- Specific Gravity
- Filler Content
- Moisture Absorption at Equilibrium
- Viscosity
- Storage Temperature
- Hardness, Shore D
- Fracture Toughness
- Adhesive Bond Strength
- Dielectric Constant
- Dissipation Factor
- CTE, linear 20°C
- Glass Temperature
- Flash Point
- Pot Life
- Shelf Life
- Appearance
- Chemical Type
- Etractable Ionic Contant, Chloride (Cl)
- Etractable Ionic Contant, Potassium (K)
- Etractable Ionic Contant, Sodium (Na)
- Particle Size
- Storage Modulus
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| Property Data |
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