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Cookson Group STAYCHIP® 3083 Low Stress Underfill with Enhanced JEDEC Performance


Subcategory: Adhesive; Thermoset

Material Notes:
STAYCHIP™ 3083 is specially formulated to minimize warpage and thermal stress within the die and at the underfill-die interface, which otherwise could initiate defects such as die cracking, fillet cracking and delamination. The low CTE and high strength & toughness of STAYCHIP™ 3083 provide excellent solder-joint protection during thermal cycling, while its superior adhesion to common solder-mask and die passivation surfaces (even after exposure to elevated heat, pressure, and humidity), ensure exceptional JEDEC performance. The fast flow characteristics are designed for penetration of gaps below 1mil.


  • Low Stress & Warpage
  • Passes JEDEC L3/ 3 x 260°C on a variety of die (up to 20 mm x 20 mm) and substrates
  • Low CTE for Excellent Reliability in Thermal Cycling
  • Exceptional Adhesion (even after exposure to high humidity, pressure, and temperature)
  • Fast, Efficient Flow Properties
  • Small particle size filler for use on fine pitch array packages

Information provided by Cookson Electronics

Available Properties
  • Specific Gravity
  • Filler Content
  • Moisture Absorption at Equilibrium
  • Viscosity
  • Storage Temperature
  • Hardness, Shore D
  • Fracture Toughness
  • Adhesive Bond Strength
  • Dielectric Constant
  • Dissipation Factor
  • CTE, linear 20°C
  • Glass Temperature
  • Flash Point
  • Pot Life
  • Shelf Life
  • Appearance
  • Chemical Type
  • Etractable Ionic Contant, Chloride (Cl)
  • Etractable Ionic Contant, Potassium (K)
  • Etractable Ionic Contant, Sodium (Na)
  • Particle Size
  • Storage Modulus
Property Data

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