Cookson Group STAYCHIP® 3103 Low Stress Underfill with Enhanced JEDEC Performance
Subcategory: Adhesive; Thermoset
Material Notes:
STAYCHIP™ 3103 is specially formulated to minimize warpage and thermal stress within the die and at the underfill-die interface, which otherwise could initiate defects such as die cracking, fillet cracking and delamination. The low CTE and high strength & toughness of STAYCHIP™ 3103 provide excellent solder-joint protection during thermal cycling, while its superior adhesion to common solder-mask and die passivation surfaces (even after exposure to elevated heat, pressure, and humidity), ensure exceptional JEDEC performance. The fast flow characteristics are designed for penetration of gaps below 1mil. Features: - Low Stress & Warpage
- Passes JEDEC L3/ 3 x 260°C on 10X10mm Polyimide passivated die
- Low CTE for Excellent Reliability in Thermal Cycling
- Exceptional Adhesion (even after exposure to high humidity, pressure, and temperature)
- Fast, Efficient Flow Properties
- Small particle size filler for use on fine pitch array packages
Information provided by Cookson Electronics
| Available Properties |
- Specific Gravity
- Filler Content
- Moisture Absorption at Equilibrium
- Viscosity
- Storage Temperature
- Hardness, Shore D
- Fracture Toughness
- Adhesive Bond Strength
- Dielectric Constant
- Dissipation Factor
- CTE, linear 20°C
- Glass Temperature
- Flash Point
- Pot Life
- Shelf Life
- Appearance
- Chemical Type
- Etractable Ionic Contant, Chloride (Cl)
- Etractable Ionic Contant, Potassium (K)
- Etractable Ionic Contant, Sodium (Na)
- Particle Size
- Storage Modulus
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| Property Data |
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