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Cookson Group Plaskon® CMU-880-MA Molded Underfill Compound for Flip Chip BGAs and CSPs


Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
This material is an epoxy Molded Underfill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON CMU Series is the total molded underfill solution for Flip Chip in Package.


  • Higher Productivity
  • Higher Tg
  • Higher Reliability
  • Lower Warpage
  • Lower CTE
  • Lower Cost of Ownership
  • Minimum 260ºC Reflow
  • Minimum JEDEC Level 3


Plaskon CMU-880-MA Molded Underfill is suitable for high volume underfill and overmold protection of Flip Chip BGA and CSP packages. It is suitable for stack die packages using a combination of wirebonded and flip chip dies where the combination of low wire sweep and underfill properties are essential.

Mold Applications:

Plaskon CMU-880-MA is suitable to vacuum assist molding approaches for underfilling flip chip packages. It will work in matrix, strip and singulated molds.

Information provided by Cookson Electronics

Available Properties
  • Specific Gravity
  • Moisture Absorption at Equilibrium
  • Viscosity
  • Spiral Flow
  • Ash
  • Storage Temperature
  • Hardness, Shore D
  • Flexural Modulus
  • Flexural Strength
  • CTE, linear 20°C
  • Thermal Conductivity
  • Glass Temperature
  • Flammability, UL94
  • Mold Temperature
  • Back Pressure
  • Cure Time
  • Cure Time
  • Gel Time
  • Shelf Life
  • Filler Shape
  • Filler Size
  • Hydrolyzable Halides
Property Data

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