Cookson Group POLYSOLDER® LS One Part Electrically Conductive Adhesive Paste

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Cookson Group POLYSOLDER® LS One Part Electrically Conductive Adhesive Paste

Subcategory: Adhesive; Thermoset; Solder/Braze Alloy

Material Notes:
This material is a lead-free, self-fluxing, no clean, environmentally acceptable solder substitute. It is specifically designed for electronic component assembly, especially surface mount. This product can be applied by either pneumatic dispensing or screen print methods, it is then hardened by thermal processing in IR, convection, conduction or vapor phase equipment. This material is a unique electronic polymer that forms stable electrical and mechanical junctions with standard components, even after extended environmental aging.

Features:

Pb-Free
Intrinsically Clean
Fine Pitch
Low Stress
Stable Junctions
Self Fluxing

Information provided by Cookson Electronics

Available Properties

Filler Content
Viscosity
Tensile Strength @ Break
Elongation at Break
Tensile Modulus
Adhesive Bond Strength
Adhesive Bond Strength
Volume Resistivity
CTE, linear 20°C
Thermal Conductivity
Glass Temperature
Pot Life
Shelf Life
300C Dry/Cured
300C Wet/Non-Cured
Bonding Range
Junction Resistivity
Peak Load
Push Off Strength
Thixotropic Index

Property Data

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