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Cookson Group POLYSOLDER® LTD One Part Electrically Conductive Adhesive Paste


Subcategory: Adhesive; Thermoset; Solder/Braze Alloy

Material Notes:
This material is a lead-free, no clean, environmentally acceptable solder substitute specifically designed for electronic component assembly, especially surface mount. This product is specially designed for pneumatic dispensing. The material is hardened by thermal processing in IR, convection, conduction or vapor phase equipment. This patented product is a unique electronics polymer material that forms stable electrical and mechanical junctions with standard components, even after extended environmental aging.


  • Pb-Free
  • Intrinsically Clean
  • Fine Pitch
  • Low Stress
  • Stable Junctions
  • Removable

Information provided by Cookson Electronics

Available Properties
  • Filler Content
  • Viscosity
  • Adhesive Bond Strength
  • Volume Resistivity
  • CTE, linear 20°C
  • Thermal Conductivity
  • Glass Temperature
  • Pot Life
  • Shelf Life
  • Assembly Temperature
  • Junction Resistivity
  • Push Off Strength
Property Data

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