Resin Technology Group TIGA R-915 Versatile, Rigid, High Thermal Conductivity Bonding System
Subcategory: Epoxy; Adhesive; Thermoset
Material Notes: 100 parts resin to 9.5 parts hardener. TIGA R-915 is a medium viscosity versatile epoxy bonding system that exhibits unusually high thermal conductivity and low thermal expansion. It is recommended for electronic/electrical bonding and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal expansion coefficients, thermal shock resistance, high heat transfer capabilities and outstanding electrical properties. Fully cured TIGA R-915 is highly resistant to weather, water, gases and vapors, petroleum lubricants and fuels and many mild acids and alkalis. Information provided by Resin Technology Group.
Available Properties |
- Specific Gravity
- Viscosity
- Hardness, Shore D
- Tensile Strength @ Break
- Compressive Strength
- Dielectric Strength
- Dissipation Factor
- Thermal Conductivity
- Maximum Service Temperature, Air
- Minimum Service Temperature, Air
- Cure Time
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Property Data |
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