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Resin Technology Group TIGA 108 Room Temperature Curing Epoxy Adhesive

 

Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
1 to1 mix ratio by volume.

TIGA 108 is an epoxy adhesive system that provides excellent bond strength to most substrates. Recommended for production bonding applications, this low viscosity formulation can be easily dispensed and mixed in convenient one to one mix ratios. TIGA 108 is a gap fill adhesive which forms water resistant bonds, therefore is ideal for bonding applications where substrates will be subjected to water or high humidity environments for long periods of time.

Applications:

This product bonds well to iron, aluminum, bronze, brass, wood concrete, ceramic materials and glass. It maintains a resistance not only to water, but oil and gasoline as well. Cures to smooth glass like finish.

Information provided by Resin Technology Group.

Available Properties
  • Specific Gravity
  • Viscosity
  • Hardness, Shore D
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • CTE, linear 20°C
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Pot Life
  • Color
   
Property Data

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