Resin Technology Group KONA 871 Low Cost Epoxy Resin

Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
Mix ratio 100 to 25 by weight.

Kona 871 is a low cost epoxy resin system developed for production casting, potting, encapsulating and coating applications where easy handling, good flowability and low thermal coefficient of expansion over a wide temperature is required. Kona 871 with its good exotherm, pot life and pouring characteristics is especially suited for large mass castings as well as for other industrial and electronic large pour applications. It develops excellent adhesion to rigid plastics, laminates, ceramics and metals, has a low coefficient of thermal expansion, and can be readily machined with ordinary shop tools. The fully cured system is a good electrical insulator and is compatible with electrical components, has good resistance to water, weather, gases and vapors and to many commercial organic and inorganic compounds including mild acids and alkalis, many corrosive salts, jet fuels and petroleum products and lubricants.

Applications:

Kona 871 is a versatile epoxy casting system, which may be cured with a room temperature or elevated temperature-curing agent. Select the catalyst that best suits your requirements.

Information provided by Resin Technology Group.