Resin Technology Group KONA 870FT-LVDP Low Viscosity Epoxy Casting System with High Thermal Conductivity

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Resin Technology Group KONA 870FT-LVDP Low Viscosity Epoxy Casting System with High Thermal Conductivity

Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
Mix ratio 2 to 1 by volume.

KONA 870 FTLV-DP is a low viscosity, versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. This product is specifically designed for use in a two to one mix ratio side-by-side dispensing system. It is recommended for small electronic/electrical casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal expansion coefficients, thermal shock resistance, high heat transfer capabilities and outstanding electrical properties. Fully cured KONA 870 FTLV-DP is highly resistant to weather, water, gases and vapors, petroleum lubricants and fuels and many mild acids and alkalis.

Information provided by Resin Technology Group.

Available Properties

Specific Gravity
Hardness, Shore D
Tensile Strength @ Break
Compressive Strength
Dielectric Strength
Dissipation Factor
Thermal Conductivity
Maximum Service Temperature, Air
Minimum Service Temperature, Air
Cure Time
Gel Time
Color

Property Data

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