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Resin Technology Group UV MX-2240 Multi-Functional Hybrid, UV-Curing, Micro-Electronic System

 

Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:
Mix ratio 2 to 1 by volume.

UV-MX 2240 is a low-viscosity, water-white photo/ chemical cross-linking encapsulant/sealant designed for micro-electronic applications. This two-part, Hybrid UV-epoxy based polymer is designed to gel with exposure to UV light followed by complete cure by internal chemical cross-link, with or without UV exposure. UV-MX 2240’s ability to “dark-cure” via conventional amine cure cross-linking makes it ideal for those applications that require the on-line speed of a UV cure and the versatility of a conventional two-part epoxy cure.

Applications:

Recommended for laminating, bonding and sealing applications of glass products where excellent wetting and outstanding impact strength is required. Electronic-Opto: Back filling of connectors, LED potting, glass touch screens.

Processing:

UV light cure: Intensity of 200 mw/cm2; Spectral output of 300 to 500 nanometers; Optimum wavelength of 375 nanometers.

Information provided by Resin Technology Group.

Available Properties
  • Specific Gravity
  • Viscosity
  • Hardness, Shore D
  • Tensile Strength @ Break
  • Elongation at Break
  • Compressive Strength
  • Shear Strength
  • Dielectric Strength
  • Dissipation Factor
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Pot Life
  • Gel Time
  • Color
   
Property Data

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