Dyna-Purge® E Purging Compound

Subcategory: Purging Compound

Material Notes:
Designed for Purging High-Temperature Engineering Resins

General Description:

DYNA-PURGE E is a high heat-resistant, non-abrasive, non-chemical “engineered” thermoplastic purging compound, formulated to purge high-temperature engineering resins. A non-melting but softening thermoplastic scrubs the screw and barrel of both injection molding machines and extruders, while the carrier matrix flushes away impurities.

FEATURES & BENEFITS OF DYNA-PURGE E

• Excellent for color to clear changes, resin changes, preventative machine maintenance, and before manual cleaning
• Effective through a wide temperature range 590°F-735°F (310°C-391°C)
• Easy to use – no process adjustment necessary – use at the resident resin processing temperature and RPM speed
• Non-abrasive, non-melting but softening thermoplastic, which thoroughly loosens carbonized and degraded resin, allowing it to be flushed out of the system
• Safe, non-hazardous, with no chemicals - ingredients are FDA compliant
• Heat stable – recommended during shutdown and start-up
• Low “cost-per-purge” – only small quantity needed to be effective
• No mixing required – simply use “as is”
• Unlimited shelf life