Dyna-Purge® P Purging Compound
Subcategory: Purging Compound
Material Notes: Designed for Hot Runner SystemsGeneral Description: DYNA-PURGE P is a non-abrasive, non-chemical “engineered” thermoplastic purging compound, formulated to have a natural flow through the barrel and hot runner system of the injection molding machine. A non-melting but softening thermoplastic scrubs the screw and barrel, while the carrier matrix flushes away impurities. FEATURES & BENEFITS OF DYNA-PURGE P - Excellent for color changes, resin changes, preventative machine maintenance, and before manual cleaning
- Developed for purging through hot runner systems with a minimum clearance of .025 inch (.65 mm)
- Effective through a wide temperature range 320°F to 575°F (160°C to 302°C)
- Easy to use – no process adjustment necessary – use at the resident resin processing temperature and RPM speed
- Non-abrasive, non-melting but softening thermoplastic, which thoroughly loosens carbonized and degraded resin, allowing it to be flushed out of the system
- Safe, non-hazardous, with no chemicals - ingredients are FDA compliant
- Heat stable – recommended during shutdown and start-up
- Low “cost per purge” – only small quantity needed to be effective
- No mixing required, simply use “as is”
- Unlimited shelf life
Dyna-Purge is the top performing purging compound on the market today. The product line offers superior cleaning and economic value over in-house methods and other commercial purging compounds. We invite you to sample Dyna-Purge at no charge, so you can prove it to yourself. Dyna-Purge, the industry leader for over 20 years!
Available Properties |
- Processing Temperature
- Amount of Purge (Injection)
- Minimum Orifice (Injection)
- Screen Packs or other flow restrictions (Inj.)
- Types of Resins
|
|
|
|
Property Data |
This page displays only the text
of a material data sheet.
To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
etc), please click the button below. |
|
|
|
|