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UBE UPILEX VT Polyimide Film

 

Subcategory: Polyimide, TS; Thermoset; Polymer

Material Notes:
Description: UPILEX, the ultra-high heat-resistant polyimide film, is the product of the polycondensation reaction between biphenyltetracarboxylic dianhydride (BPDA), of which process Ube Industries originally developed, and diamine. Thanks to its outstanding characteristics over a wide temperature range, UPILEX has been the subject of much attention as a new material for use in the electronics and other leading-edge industries. Most notable of these characteristics is UPILEX's physical, mechanical, electrical, and chemical properties under high-temperature conditions.

UPILEX VT is a heat bonding type of polyimide film without using adhesive and applicable with various substrate material.

Features:

  • Heat bonding ability with ceramics, silicon wafers, and metals
  • Bonding temperature : 300°C
  • Excellent characteristics as polyimide film

Applications:

  • FPC
  • HDD Suspension
  • Ceramics Lamination
  • Metal substrate PCB
  • Sheet heater
  • Micro Machine

Information provided by UBE.

Available Properties
  • Film Tensile Strength at Break, MD
  • Film Elongation at Break, MD
  • Secant Modulus, MD
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • CTE, linear 100°C
  • Shrinkage
   
Property Data

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