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UBE UPILEX-25S (25 micron) Polyimide Film

 

Subcategory: Polyimide, TS; Thermoset; Polymer

Material Notes:
Description: UPILEX, the ultra-high heat-resistant polyimide film, is the product of the polycondensation reaction between biphenyltetracarboxylic dianhydride (BPDA), of which process Ube Industries originally developed, and diamine. Thanks to its outstanding characteristics over a wide temperature range, UPILEX has been the subject of much attention as a new material for use in the electronics and other leading-edge industries. Most notable of these characteristics is UPILEX's physical, mechanical, electrical, and chemical properties under high-temperature conditions.

UPILEX-S demonstrates outstanding mechanical characteristics through a wide temperature range. UPILEX-S displays high tensile strength and modulus, and also features outstanding long-term heat resistance. Another advantage inherent in UPILEX-S is its high resistance to hydrolysis, as its properties are practically unaffected, even by immersion in boiling water for long periods of time.

Information provided by UBE.

Available Properties
  • Density
  • Water Absorption
  • Moisture Absorption at Equilibrium
  • Water Vapor Transmission
  • Oxygen Transmission Rate
  • Carbon Dioxide Transmission
  • Film Tensile Strength at Yield, MD
  • Film Tensile Strength at Break, MD
  • Film Elongation at Break, MD
  • Secant Modulus, MD
  • Coefficient of Friction
  • Tear Strength Test
  • Volume Resistivity
  • Surface Resistance
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • CTE, linear 100°C
  • Specific Heat Capacity
  • Thermal Conductivity
  • Glass Temperature
  • Flammability, UL94
  • Oxygen Index
  • Shrinkage
  • Folding endurance [MIT]
  • Resistance to Organic Solvents
  • Resistance to Strong Acids
  • Resistance to Strong Alkalis
  • Temperature Index
   
Property Data

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