UBE UPIMOL-R Polyimide Shape
Subcategory: Polyimide, TS; Thermoset
Material Notes:
Description: Ube's UPIMOL is an exceptionally heat-resistant polyimide Shape. This product has the same molecular structure as UPILEX, an ultra-high heat-resistant polyimide film developed by Ube, produced through polycondensation of biphenyltetracarboxylic dianhydride and diamine. Depending on the type of application, there are two types of UPIMOL available. One is UPIMOL-R for general use and the other is UPIMOL-S for high heat-resistant use. While exhibiting a number of excellent properties over a wide temperature range, of special note are UPIMOL's exceptional mechanical, thermal and chemical properties at high temperatures. Since UPIMOL has been shown to satisfy even the exacting requirements of the ceramics industry, its applications are extremely wide-ranging, the major uses including: - Electrical and Electronic Equipment
- IC sockets for semiconductor testing machine handlers
- Collet for IC mounter
- Frictional parts such as copier bearings
- Wire guides for wire dot printers
- Industrial Equipment
- Piston rings for compressors, etc.
- Thrust washers for gears, etc.
- Radiation and chemical resistant pipe sealings and other such parts.
- Aerospace-Related Equipment
- Vane bushings for jet engines
- Spline couplings for aircraft
- Insulating parts, spacers, etc, for artificial satellites.
Information provided by UBE.
| Available Properties |
- Water Absorption
- Water Absorption at Saturation
- Hardness, Rockwell M
- Tensile Strength, Ultimate
- Tensile Strength, Ultimate at Elevated Temperature
- Elongation at Yield
- Flexural Modulus
- Flexural Yield Strength
- Compressive Strength
- Compressive Modulus
- Izod Impact, Notched
- Izod Impact, Unnotched
- Coefficient of Friction
- Limiting Pressure Velocity
- Taber Abrasion, mg/1000 Cycles
- Abrasion
- Volume Resistivity
- Surface Resistance
- Dielectric Constant
- Dielectric Strength
- Dissipation Factor
- Arc Resistance
- CTE, linear 20°C
- CTE, linear 100°C
- CTE, linear 250°C
- Specific Heat Capacity
- Thermal Conductivity
- Deflection Temperature at 0.46 MPa (66 psi)
- Decomposition Temperature
- Compressive Creep
- Thermal Weight Reduction (in Air)
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| Property Data |
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