UBE UPISEL-N BE1210 Copper Clad Laminate
Subcategory: Metal
Material Notes:
Description: UPISEL-N BE1210 is non-adhesive type flexible Copper Clad Laminate (Polyimide = 25µm, Cu = 18µm) based on "UPILEX-VT." UPISEL-N has excellent dimensional stability and heat resistance. "UPILEX-VT" performs high bonding ability without any use of adhesives by simple heat lamination. "UPILEX-VT" is an aromatic polyimide same as "UPILEX-S" which has high market share as the base film for TAB (Tape Automated Bonding). Applications: - FPC
- TCP
- MCM-L
- COF
- Rigid flex
- Multi-layer boards
- Metal based boards
- High frequency boards
- Heat-resistant boards
- IC cards
- Boards for automobile
- Electromagnetic wave shield material
- HDD suspension
Characteristics: - Without the use of adhesives, UPISEL-N maintains high physical properties and high reliability at high temperatures
- It performs excellent peeling strength, heat soldering resistance, chemical resistance and dimensional stability
- The film layer of the UPISEL-N can be heat bonded with ceramics, metals and silicon chip
- Without the use of adhesives, UPISEL-N is tender for the environment
Information provided by UBE.
| Available Properties |
- Water Absorption
- Elongation at Break
- Tensile Modulus
- Peel Strength
- Volume Resistivity
- Surface Resistance
- Dielectric Constant
- Dielectric Strength
- Dissipation Factor
- Flammability, UL94
- Shrinkage
- Flexural Endurance (MD)
- Flexural Endurance (TD)
- Folding Endurance RO.4 (MD)
- Folding Endurance RO.4 (TD)
- Hot Solder Resistance: 300°C 1 min.
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| Property Data |
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