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Gwent Electronic Materials (GEM) Low Temperature Polymer Dielectric / Insulator for Untreated Substrates: D2030506D3 Low Temperature Polymer Dielectric

 

Subcategory: Additive/Filler for Polymer; Adhesives, Sealants, and Coatings

Material Notes:
D2030506D3 low temperature cure dielectric is suitable for use as an insulating layer when printed onto untreated aluminum, glass or alumina substrates. It is compatible with a range of silver and carbon curing systems in order to construct simple circuits. This material gives a clear film when printed.

These products are based on a unique curing process that results in the low temperature formation of a thermosetting insulation ink that combines good adhesion and insulation resistance with chemical, environmental and abrasion resistance. They offer the advantage of a One-Pack cure system combined with the convenience of ambient temperature stability and cure temperatures in the range of 130-180°C.

Information provided by Gwent Electronic Materials Ltd.

Available Properties
  • Viscosity
  • Storage Temperature
  • Maximum Service Temperature, Air
  • Cure Time
  • Shelf Life
  • Coverage cm2/g
  • Fineness of Grind, max, microns
  • Fineness of Grind, microns
  • Printing Mesh counts/inch
   
Property Data

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